Kingston Technology 960G DC600M (Mixed-Use) 2.5” Enterprise SATA SSD

Kingston’s DC600M and DC600ME SSDs are fourth-generation data center SATA 3.0, 6Gbps SSDs utilising 3D TLC NAND intended for “mixed use” server workloads. Both are well suited for a wide variety of server applications and include on-board power loss protection via hold-up capacitors. DC600M and DC600ME are designed to protect data against unexpected power failure and to ensure the drive will successfully reinitialise on the next power-up of the system. Designed to deliver low latency and IO consistency for system integrators, hyperscale data centers and cloud service providers.

DC600ME features AES 256-bit encryption and supports TCG OPAL 2.0 security standards.

Capacities available from 480GB–7.68TB* to meet your data storage requirements.

Designed for data center environments
Optimised to meet the high demands of server RAID applications with low latency and IO consistency as the key design criteria.

Hardware-based PLP
Power loss capacitors to protect user data against unexpected power loss and enhance performance.

Delivers excellent quality of service (QoS)*
Optimised performance predictability to meet
service-level agreements (SLAs).

AES 256-bit Encryption with DC600ME
Protect sensitive data with support for AES 256-bit hardware-based encryption and TCG Opal 2.0 security standards with DC600ME.

Capacities up to 7.68TB
Upgrade and manage storage with capacities up to 7.68TB.*

Kingston Technology 960G DC600M (Mixed-Use) 2.5” Enterprise SATA SSD. SSD capacity: 960 GB, SSD form factor: 2.5", Read speed: 560 MB/s, Write speed: 530 MB/s, Data transfer rate: 6 Gbit/s, Component for: Server/workstation

Features
SSD capacity	960 GB
SSD form factor	2.5"
Interface	Serial ATA III
Memory type	3D TLC NAND
Component for	Server/workstation
Hardware encryption	No
Target workload	Mixed Use (MU)
Data transfer rate	6 Gbit/s
Read speed	560 MB/s
Write speed	530 MB/s
Random read (4KB)	94000 IOPS
Random write (4KB)	65000 IOPS
Read latency	200 µs
Write latency	30 µs
Hot-Plug support	Yes
H/W PLP function	Yes
Mean time between failures (MTBF)	2000000 h
TBW rating	1752
Use conditions	Server/Enterprise
Power
Power consumption (read)	1.6 W
Power consumption (write)	3.6 W
Power consumption (average)	1.45 W
Power consumption (idle)	1.3 W
Weight & dimensions
Width	69.8 mm
Depth	100.1 mm
Height	7 mm
Weight	69 g
Packaging data
Package width	129.5 mm
Package depth	9.14 mm
Package height	184.2 mm
Package weight	91.2 g
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Operating vibration	2.17 G
Non-operating vibration	20 G
Logistics data
Country of origin	China, Taiwan
Master (outer) case width	135.9 mm
Master (outer) case length	203.2 mm
Master (outer) case height	69.8 mm
Master (outer) case gross weight	989.98 g
Products per master (outer) case	10 pc(s)