Cooler Master HTK-002 heat sink compound 4.5 W/m·K 4.6 g

>4.5 W/m-K, 0.02 C-in2/W, 4.6 g
CPU - Heatsink
1 Item
Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177oC (350oF), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

  • Design

    • Product colour:White
  • Features

    • Thermal conductivity:4.5 W/m·K
    • Thermal resistance:0.02 °C/W
    • Specific gravity:2.63 g/cm³
  • Weight & dimensions

    • Weight:4.6 g
    • Package width:102 mm
    • Package depth:171 mm
    • Package height:40 mm
  • Packaging data

    • Quantity:1
1 Item

Specific References

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